Dicing process
Dicing processing. From dicing to chip tray packing and appearance inspection.
Research and challenge even difficult processing! From dicing to chip tray packing and appearance inspection! Dicing processing by Sahara Techno Industry 【Features】 ○ Skilled in high-difficulty processing for ultra-slim chip ICs, compact ICs, and foreign matter countermeasure ICs ○ High-quality processing through step cutting ○ Chip tray packing using automatic sorting machines ○ High-reliability inspection using metal microscopes ○ Wafer sizes: 4 inches, 5 inches, 6 inches, 8 inches ● For more details, please contact us.
- Company:佐原テクノ工業
- Price:Other